机构上调PCB赛道增长预期，上市公司密集布局高端产能

Institutions have raised their growth forecasts for the PCB sector, with listed companies aggressively investing in high-end production capacity.

【环球网财经综合报道】 PCB作为电子设备核心基础元器件，是AI算力集群稳定运行的关键硬件载体。

[Global Times Finance ] PCBs, as core foundational components of electronic devices, are the key hardware enablers for the stable operation of AI computing clusters.

在AI算力基础设施大规模建设的影响下，高盛8月6日发布的报告中，大幅上调了AI服务器相关市场规模预测，预计全球AI服务器PCB市场将在2027年达到375亿美元，较此前预测金额增长38%，2028年更进一步上调至840亿美元。

Driven by the large‑scale build‑out of AI computing infrastructure, Goldman Sachs, in a report released on August 6, substantially raised its forecast for the AI‑server‑related market size. The bank projects that the global AI‑server PCB market will hit USD 37.5 billion in 2027, representing a 38% increase from its prior forecast, and will further climb to USD 84 billion in 2028.

伴随行业景气度持续攀升，产业链上市公司正积极调整产能布局重心，通过新建智造基地、收购厂房、产线技改等多种方式加码布局高端产能，巩固企业核心竞争优势。

Amid the sustained industry boom, listed players across the industrial chain are refocusing their capacity deployment. They are ramping‑up investment in high‑end capacity via multiple measures: constructing new intelligent‑manufacturing bases, acquiring plant facilities, and carrying out production‑line technical upgrades, so as to consolidate their core competitive strengths.

7月23日，鹏鼎控股发布公告称，公司拟投资100亿元新建深圳第三园区，并建设人工智能高阶类载板及柔性电路板智造基地项目。同日，红板科技公告显示，公司全资子公司拟在现有厂区内实施高阶mSAP（改良型半加成法‌）高端精密电路板产业化项目，预计总投资不超过50亿元。

On July 23, Pengding Holdings announced its plan to invest RMB 10 billion to develop the Third Shenzhen Campus, an intelligent‑manufacturing base for AI high‑end substrates and flexible circuit boards. On the same day, Hongban Technology disclosed that its wholly‑owned subsidiary intends to launch an industrialization project for high‑precision PCBs adopting advanced mSAP (modified semi‑additive process) within its existing plant premises, with total investment capped at RMB 5 billion.

沪电股份则通过现有厂区挖潜、新增厂房两条路径同步扩产。该公司近期在投资者活动记录表中提到，公司聚焦高阶PCB的瓶颈及关键制程，实施迭代升级与靶向性产能扩充，持续深挖现有厂区的高附加值产出潜力；为加快推进高端扩产项目的建设，2026年第一季度，公司加速启动了一系列产能扩充计划。

Hudian Electronics Co., Ltd. is expanding output through two parallel approaches: unlocking capacity potential at existing facilities and constructing new plant buildings. As noted in its investor‑communication meeting minutes, the firm targets bottlenecks and critical processes for high‑end PCBs by rolling out iterative upgrades and targeted capacity expansion to tap higher‑value output potential from existing sites. To speed up its high‑end capacity‑expansion projects, the firm kicked off a set of capacity‑boosting initiatives in Q1 2026.

一博科技在投资者关系活动记录表中提到，公司目前20层PCB样板已实现8天时间交付，能快速满足客户高速、高多层、高阻抗精度、高阶HDI及任意层互联等技术要求。（南木）

According to minutes from Yibo Technology’s investor‑relations meeting, the company now achieves an 8‑day turnaround for 20‑layer PCB prototypes. It can swiftly satisfy customer technical specifications including high‑speed performance, high‑layer‑count boards, precise high‑impedance control, advanced HDI, and any‑layer interconnection. (Nanmu)